The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Mar. 08, 2024
Applicant:

Daikin Industries, Ltd., Osaka, JP;

Inventors:

Hirokazu Komori, Osaka, JP;

Hiroyuki Yoshimoto, Osaka, JP;

Masaji Komori, Osaka, JP;

Yuki Ueda, Osaka, JP;

Junpei Terada, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 5/02 (2006.01); B32B 15/082 (2006.01); B32B 15/20 (2006.01); B32B 17/10 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); C08F 214/26 (2006.01); C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 15/082 (2013.01); B32B 15/20 (2013.01); B32B 17/10 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); B32B 27/322 (2013.01); C08F 214/262 (2013.01); C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01); B32B 2262/101 (2013.01); B32B 2264/1021 (2020.08); B32B 2457/08 (2013.01); C08F 2800/10 (2013.01); C08J 2327/18 (2013.01); H05K 2201/015 (2013.01);
Abstract

A laminate, including a fluororesin sheet; and a base material. The fluororesin sheet including a fluororesin composition containing: a melt moldable fluororesin; and a silica. The fluororesin is a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and/or a tetrafluoroethylene-hexafluoropropylene copolymer having 25 or more carbonyl group-containing functional groups per 10main-chain carbon atoms; the silica is a spherical silica; a blending ratio of the spherical silica to a total amount of the fluororesin and the silica is 50% by mass or higher and 70% by mass or lower; the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower and a melt flow rate (MFR) of 1.0 g/10 min or higher and 30 g/10 min or lower. Also disclosed is a substrate for circuits including the fluororesin sheet used as a part in a multilayer structure.


Find Patent Forward Citations

Loading…