The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

May. 06, 2024
Applicant:

Hella Gmbh & Co. Kgaa, Lippstadt, DE;

Inventors:

Sebastian Bartscher, Hamm, DE;

Fabian Evers, Delbrueck, DE;

Heinz-Peter Kleeschulte, Anroechte, DE;

Werner Koesters, Coesfeld-Lette, DE;

Michael Lakenbrink, Oelde, DE;

Konrad Schuerhoff, Rietberg, DE;

Thomas Wiese, Lippstadt, DE;

Assignee:

Hella GmbH & Co. KGaA, Lippstadt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); F21S 41/141 (2018.01); F21S 45/47 (2018.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); F21S 41/141 (2018.01); F21S 45/47 (2018.01); F21Y 2115/10 (2016.08); H05K 2201/066 (2013.01); H05K 2201/09036 (2013.01);
Abstract

The present invention relates to a support assembly for an electronic component, at least including a metallic heat sink, and a plastic element with a receiving section for accommodating the electronic component. The plastic element is connected to the heat sink in a form-fit manner. The receiving section of the plastic element covers a heat input side of the heat sink. The plastic element includes a thermosetting plastic with fillers for increasing the thermal conductivity.


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