The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Nov. 30, 2022
Applicant:

Aac Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Kaijie Wang, Shenzhen, CN;

Zhuanzhuan Zhao, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 1/04 (2006.01); H04R 1/06 (2006.01); H04R 7/06 (2006.01); H04R 7/18 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 1/04 (2013.01); H04R 1/06 (2013.01); H04R 7/06 (2013.01); H04R 7/18 (2013.01); H04R 2201/003 (2013.01);
Abstract

A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.


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