The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Sep. 15, 2022
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Hiroaki Ono, Makinohara, JP;

Toru Suzuki, Makinohara, JP;

Noboru Hayasaka, Makinohara, JP;

Kazuya Takeda, Makinohara, JP;

Tatsuya Hosono, Makinohara, JP;

Jun Sugioka, Makinohara, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/504 (2006.01); H01R 13/405 (2006.01); H01R 13/52 (2006.01); H01R 13/533 (2006.01);
U.S. Cl.
CPC ...
H01R 13/504 (2013.01); H01R 13/405 (2013.01); H01R 13/5205 (2013.01); H01R 13/533 (2013.01);
Abstract

The present disclosure relates to a connector and a manufacturing method or a connector. The connector includes: a terminal fitting; and a housing holding the terminal fitting. The housing includes a first resin molded body in which at least a part of the terminal fitting is embedded, the first resin molded body being made of a first material, and a second resin molded body in which at least a part of the first resin molded body is embedded, the second resin molded body being made of a second material. The first material has a linear thermal expansion coefficient smaller than that of the second material.


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