The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Apr. 23, 2021
Applicants:

Beijing Boe Technology Development Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jian Zhou, Beijing, CN;

Feng Wang, Beijing, CN;

Yuju Chen, Beijing, CN;

Feng Qu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01);
Abstract

The present disclosure provides a manufacturing method of a metal mesh, a thin film sensor and a manufacturing method of the thin film sensor, and belongs to the technical field of electronic devices. The manufacturing method of the metal mesh of the present disclosure includes: providing a base substrate; forming a pattern including a first epitaxial structure on the base substrate through a patterning process, wherein the first epitaxial structure has a first groove in a mesh shape; forming a first dielectric layer covering on a side of the first epitaxial structure away from the base substrate, so as to form a second groove in a mesh shape; and forming a metal material in the second groove on a side of the first dielectric layer away from the base substrate through a patterning process, so as to form a metal mesh.


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