The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Oct. 22, 2018
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Mei See Boon, Sungai Siput, MY;

Hui Chiang Teoh, Jitra, MY;

Tomin Liu, Kuching, MY;

Hui Ying Pee, Penang, MY;

Asliza Alias, Penang, MY;

Lay Teng Tan, Penang, MY;

Yuan Liang, Penang, MY;

Alex Kheng Hooi Lim, Penang, MY;

Wing Yew Wong, Penang, MY;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01);
Abstract

In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.


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