The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
May. 17, 2023
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventor:
Yeong-E Chen, Miao-Li County, TW;
Assignee:
Innolux Corporation, Miaolli County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/538 (2006.01); H01L 25/04 (2023.01); H01L 25/075 (2006.01); H10F 71/00 (2025.01); H10F 77/00 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/5386 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H10F 71/139 (2025.01); H10F 77/933 (2025.01); H10H 20/857 (2025.01); H10H 20/0364 (2025.01);
Abstract
An electronic device is provided. The electronic device includes a circuit structure layer, a package structure, and an electronic element. The circuit structure layer includes a circuit layer and a plurality of first conductive pads. The package structure is disposed on the circuit structure layer. The electronic element is embedded in the package structure. The electronic element is electrically connected to the circuit layer through the plurality of first conductive pads. A thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element.