The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Feb. 05, 2021
Applicant:
Raytheon Company, Arlington, VA (US);
Inventors:
Patrick E. Boyle, Dorchester, MA (US);
James E. Benedict, Chelmsford, MA (US);
Erika Klek, Wilmington, MA (US);
Mikhail Pevzner, Woburn, MA (US);
Assignee:
Raytheon Company, Arlington, VA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48482 (2013.01); H01L 2224/85047 (2013.01);
Abstract
Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.