The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Sep. 29, 2021
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
John Carlo Cruz Molina, Limay, PH;
Rafael Jose Lizares Guevara, Manila, PH;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 2224/02235 (2013.01); H01L 2224/0225 (2013.01); H01L 2224/02255 (2013.01); H01L 2224/0226 (2013.01); H01L 2224/03013 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48247 (2013.01);
Abstract
A semiconductor die includes a semiconductor surface including circuitry electrically connected to top-level bond pads exposed on a top surface of the semiconductor die, the top-level bond pads including inner bond pads and outer bond pads positioned beyond the inner bond pads. There is solder on at least the inner bond pads. A ring structure is positioned around a location of at least the inner bond pads.