The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Jun. 12, 2023
Applicant:
The University of Chicago, Chicago, IL (US);
Inventors:
Dmitri V. Talapin, La Grange Park, IL (US);
Yuanyuan Wang, Nanjing, CN;
Hao Zhang, Evanston, IL (US);
Assignee:
THE UNIVERSITY OF CHICAGO, Chicago, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 11/02 (2006.01); C09K 11/08 (2006.01); C09K 11/58 (2006.01); C09K 11/62 (2006.01); C09K 11/66 (2006.01); C09K 11/67 (2006.01); C09K 11/70 (2006.01); C09K 11/74 (2006.01); C09K 11/77 (2006.01); C09K 11/88 (2006.01); C09K 11/89 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H10D 30/67 (2025.01); H10F 77/45 (2025.01); H10H 20/851 (2025.01);
U.S. Cl.
CPC ...
G03F 7/0042 (2013.01); C09K 11/025 (2013.01); C09K 11/0883 (2013.01); C09K 11/58 (2013.01); C09K 11/623 (2013.01); C09K 11/661 (2013.01); C09K 11/671 (2013.01); C09K 11/70 (2013.01); C09K 11/7492 (2013.01); C09K 11/7716 (2013.01); C09K 11/7773 (2013.01); C09K 11/883 (2013.01); C09K 11/892 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); H01L 21/02565 (2013.01); H01L 21/02628 (2013.01); H01L 21/0273 (2013.01); H10D 30/6755 (2025.01); H10F 77/45 (2025.01); H10H 20/8512 (2025.01);
Abstract
Ligand-capped inorganic particles, films composed of the ligand-capped inorganic particles, and methods of patterning the films are provided. Also provided are electronic, photonic, and optoelectronic devices that incorporate the films. The ligands that are bound to the inorganic particles are composed of a cation/anion pair. The anion of the pair is bound to the surface of the particle and at least one of the anion and the cation is photosensitive.