The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Feb. 06, 2024
Applicant:

Ii-vi Delaware, Inc., Wilmington, DE (US);

Inventors:

Andrei Kaikkonen, Jarfalla, SE;

David Adams, Stockholm, SE;

Robert Lewen, Tyreso, SE;

Nicolae Chitica, Kista, SE;

Assignee:

II-VI Delaware, Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/06 (2006.01); G02F 1/025 (2006.01); G02F 1/015 (2006.01);
U.S. Cl.
CPC ...
G02F 1/025 (2013.01); H01S 5/0601 (2013.01); G02F 1/0157 (2021.01); G02F 2202/101 (2013.01); G02F 2202/102 (2013.01); G02F 2202/108 (2013.01);
Abstract

An electro-absorption modulator (EAM) is configured to include an on-chip AC ground plane that is used to terminate the high frequency RF input signal within the chip itself. This on-chip ground termination of the modulation input signal improves the frequency response of the EAM, which is an important feature when the EAM needs to support data rates in excess of 50 Gbd. By virtue of using an on-chip ground for the very high frequency signal content, it is possible to use less expensive off-chip components to address the lower frequency range of the data signal (i.e., for frequencies less than about 1 GHz).


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