The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Aug. 05, 2022
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Robert A. Briano, Auburn, NH (US);

Michael C. Doogue, Bedford, NH (US);

William P. Taylor, Amherst, NH (US);

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 19/00 (2006.01); G01R 15/14 (2006.01); G01R 15/20 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
G01R 19/0092 (2013.01); G01R 15/146 (2013.01); G01R 15/207 (2013.01); H01L 21/4821 (2013.01); H01L 23/4951 (2013.01); H01L 23/49531 (2013.01); H01L 24/45 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/301 (2013.01); H01L 2224/4502 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10977 (2013.01);
Abstract

A sensor package comprising a lead frame, a current sensor die, and an interposer. The lead frame includes: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads. The current sensor die includes one or more sensing elements. The current sensor die is configured to measure a level of electrical current through the primary conductor of the lead frame. The interposer is disposed over the layer of dielectric material. The interposer includes a plurality of conductive traces that are configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads.


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