The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Feb. 08, 2021
Applicant:

Shenzhen New Degree Technology Co., Ltd., Guangdong, CN;

Inventors:

Tuoxia Huang, Guangdong, CN;

Jinbo Yu, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/22 (2006.01); G01L 1/14 (2006.01); G01L 1/18 (2006.01); H01L 29/8605 (2006.01); H01L 49/02 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G01L 1/2293 (2013.01); G01L 1/148 (2013.01); G01L 1/2262 (2013.01); G01L 1/2281 (2013.01); H01L 28/20 (2013.01); H01L 29/8605 (2013.01); G01L 1/18 (2013.01); G06F 3/041 (2013.01); G06F 2203/04105 (2013.01);
Abstract

The present application relates to a pressure sensing device and a pressure sensing apparatus. The pressure sensing device () includes: one or more pressure sensing sheet (), and a first substrate () configured for carrying the pressure sensing sheet (); the pressure sensing sheet () is connected with the first substrate () by welding, and welding points are configured for transmitting a deformation and transmitting an electrical signal, and the pressure sensing sheet includes at least one semiconductor film (), and a signal measurement circuit is integrated in the at least one semiconductor film (), and the signal measurement circuit is configured for detecting an amount of the deformation and outputting the electrical signal that is able to be identified. Integrating the signal detection circuit in the semiconductor film () is greatly reduce the volume of the structure, which is beneficial to improve the integration degree of the product, and is beneficial to the miniaturization of the product.


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