The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Jan. 06, 2021
Applicant:

Autel Intelligent Technology Corp., Ltd., Guangdong, CN;

Inventor:

Wenhui Luo, Guangdong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/275 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G01B 11/2755 (2013.01); G06T 7/0004 (2013.01); G01B 2210/283 (2013.01); G01B 2210/303 (2013.01); G06T 2207/30204 (2013.01);
Abstract

The present invention belongs to the field of machine vision system technologies, and discloses a target unit of a machine vision system, a target assembly and a machine vision system, the target unit including a protective plate, a light absorbing layer and a light reflecting layer. The protective plate includes a connection surface. The light reflecting layer is connected to the light absorbing layer, one of the light absorbing layer and the light reflecting layer includes a preset pattern and is connected to the protective plate through the connection surface, and a surface that is of the other of the light absorbing layer and the light reflecting layer and that faces away from the protective plate is an outer surface of the target unit. In the target unit in the embodiments of the present invention, the protective plate can provide functions such as mechanical support, flatness and water resistance and scratch resistance, and a substrate in the prior art can be omitted, so that the weight of the target unit in this embodiment is reduced, and the thickness of a product is reduced, enabling that it is possible to make a thinner product. In addition, a product assembly process is simplified, and product costs are reduced.


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