The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Mar. 09, 2020
Tesa SE, Norderstedt, DE;
Benjamin Pütz, Neuss, DE;
Sarah Zimmermann, Elmshorn, DE;
tesa SE, Norderstedt, DE;
Abstract
Pressure-sensitive adhesives, adhesive tapes, and methods enable high bond strengths on non-polar or rough substrates. The pressure-sensitive adhesives and methods comprise (a) at least one poly(meth)acrylate, (b) at least one resin A selected from colophony resins and terpene-phenolic resins, (c) at least one hydrocarbon resin B1 having a softening point of greater than 50° C., and (d) at least one hydrocarbon resin B2 having a softening point of less than or equal to 25° C. The adhesive tapes comprise one or more layers of the pressure-sensitive adhesives, and the methods may produce adhesive bonds on substrates with low surface energy and/or on substrates with a mean roughness of at least 5 μm.