The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Mar. 28, 2023
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventor:
Yoshihiro Tsutsumi, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); C09J 5/06 (2006.01); C09J 179/08 (2006.01); B29C 65/02 (2006.01); B29C 65/40 (2006.01); B29C 65/48 (2006.01);
U.S. Cl.
CPC ...
C09J 5/06 (2013.01); B32B 7/12 (2013.01); B32B 9/045 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B32B 37/1207 (2013.01); C09J 179/08 (2013.01); B29C 65/02 (2013.01); B29C 65/405 (2013.01); B29C 65/4835 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/7376 (2023.05); C09J 2479/08 (2013.01);
Abstract
Provided is a method for producing a cured product of a heat-curable maleimide resin composition, that causes no curing failure and no appearance failure associated therewith. The method is for producing a cured product of a heat-curable maleimide resin composition containing: