The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Jan. 26, 2022
Applicant:

Commissariat À L'énergie Atomique ET Aux Énergies Alternatives, Paris, FR;

Inventor:

Bernard Viala, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 3/215 (2006.01); C08K 3/04 (2006.01); C08K 3/38 (2006.01); C08K 9/02 (2006.01); H01F 1/147 (2006.01);
U.S. Cl.
CPC ...
C08J 3/215 (2013.01); C08K 3/04 (2013.01); C08K 3/38 (2013.01); C08K 9/02 (2013.01); H01F 1/147 (2013.01); C08J 2325/06 (2013.01); C08J 2327/16 (2013.01); C08J 2333/10 (2013.01); C08J 2363/00 (2013.01); C08J 2379/08 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/01 (2013.01); C08K 2201/011 (2013.01);
Abstract

Method for manufacturing a composite material comprising a polymer and nanomaterials, the method comprising the following steps: dissolution of the polymer in a first solvent, whereby a first solution is obtained, dispersion of the nanomaterials in a second solvent, different from the first solvent, whereby a second solution is obtained, mixing of the two solutions, whereby a third solution is obtained, heating of the third solution so as to evaporate the second solvent, whereby a final solution is obtained, deposition of the final solution on a substrate and evaporation of the first solvent, the second solvent having a boiling point lower by at least 30° C. than that of the first solvent, and the viscosity of the final solution being equal to some 10% of the viscosity of the first solution.


Find Patent Forward Citations

Loading…