The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

May. 14, 2021
Applicant:

Aac Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventor:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0086 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0136 (2013.01); B81B 2203/0346 (2013.01);
Abstract

A microelectromechanical system includes a backplate and a diaphragm. The backplate includes spaced stator elements with voids formed therebetween. The stator element includes a first conductive element. The diaphragm includes a plurality of corrugations facing the voids respectively. Each corrugation includes a groove formed at a surface thereof away from the backplate. The corrugation includes a second conductive element. The diaphragm is moveable with respect to the backplate in response to a pressure exerted thereon to cause the corrugations to be moved into or out of the corresponding voids, thereby changing the capacitance formed between the first and second conductive elements. The corrugations are defined by grooves formed at surfaces away from the backplate, which facilitate to control the compliance of the diaphragm and reduce stiffness of the diaphragm. The corrugation can be formed with lower aspect ratios, which allows it to be formed using standard front side processes.


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