The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Apr. 22, 2022
Applicant:

Rosemount Aerospace Inc., Burnsville, MN (US);

Inventor:

John C. Christenson, Prior Lake, MN (US);

Assignee:

Rosemount Aerospace Inc., Burnsville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 1/14 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01L 1/14 (2006.01); G01L 1/18 (2006.01); H10N 30/30 (2023.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81C 1/00269 (2013.01); G01L 1/142 (2013.01); G01L 1/18 (2013.01); H10N 30/302 (2023.02); B81B 2203/019 (2013.01);
Abstract

A stress-sensitive device includes a substrate having a first surface with a cavity defined therein and a three-dimensional deformable material extending along the first surface and into the cavity. The three-dimensional deformable material has an electrical characteristic responsive to deformation. A method of forming a three-dimensional stress-sensitive device includes providing a substrate having a first surface and a second surface opposite the first surface, forming a cavity in the substrate, wherein the cavity is open to the first surface, depositing a sacrificial layer in the cavity, depositing a deformable material on the sacrificial layer, and removing at least a portion of the sacrificial layer to form an interstitial space between the deformable material and the substrate in the cavity.


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