The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Dec. 11, 2020
Applicant:
Nelumbo Inc., Hayward, CA (US);
Inventors:
Nicholas Joseph Montes, Hayward, CA (US);
Cody D. Oliver, Hayward, CA (US);
Lance R. Brockway, Hayward, CA (US);
David C. Walther, Hayward, CA (US);
Assignee:
NELUMBO INC., Hayward, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 17/02 (2006.01); B32B 5/02 (2006.01); B32B 7/027 (2019.01); B32B 9/02 (2006.01); B32B 33/00 (2006.01); C04B 35/04 (2006.01); C04B 35/10 (2006.01); C04B 35/453 (2006.01); C04B 38/00 (2006.01); C08J 5/12 (2006.01); C09D 1/00 (2006.01); C09D 5/08 (2006.01); C09D 201/00 (2006.01); C23C 8/02 (2006.01); C23C 8/52 (2006.01); C23C 22/06 (2006.01); D06M 11/44 (2006.01); D06M 11/83 (2006.01); D06M 23/06 (2006.01); F28F 19/06 (2006.01); D06M 101/06 (2006.01); D06M 101/32 (2006.01); D06M 101/34 (2006.01);
U.S. Cl.
CPC ...
B32B 7/027 (2019.01); B32B 5/024 (2013.01); B32B 9/02 (2013.01); B32B 17/02 (2013.01); B32B 33/00 (2013.01); C04B 35/04 (2013.01); C04B 35/10 (2013.01); C04B 35/453 (2013.01); C04B 38/0058 (2013.01); C04B 38/0064 (2013.01); C04B 38/0096 (2013.01); C08J 5/121 (2013.01); C09D 1/00 (2013.01); C09D 5/08 (2013.01); C09D 201/00 (2013.01); C23C 8/02 (2013.01); C23C 8/52 (2013.01); C23C 22/06 (2013.01); D06M 11/44 (2013.01); D06M 11/83 (2013.01); D06M 23/06 (2013.01); F28F 19/06 (2013.01); B32B 2255/20 (2013.01); B32B 2262/08 (2013.01); B32B 2262/101 (2013.01); B32B 2262/128 (2021.05); B32B 2305/188 (2013.01); B32B 2307/304 (2013.01); B32B 2307/728 (2013.01); B32B 2307/73 (2013.01); B32B 2315/02 (2013.01); B32B 2315/08 (2013.01); B32B 2317/10 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3284 (2013.01); C04B 2235/96 (2013.01); D06M 2101/06 (2013.01); D06M 2101/32 (2013.01); D06M 2101/34 (2013.01); D06M 2200/12 (2013.01);
Abstract
Assemblies of stacked layers of materials are described. The assemblies include functional and structural layers. Functional layers include binderless ceramic materials on woven or non-woven substrates of natural, synthetic, or metallic materials. The layers of functional and structural materials may be configured to transport moisture or heat from an inner surface to an outer surface that is exposed to an ambient environment.