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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12263015 B1

PDFFull Text
Date of Patent:
Apr. 01, 2025

Filed:

Jan. 27, 2021

In-vivo implantable electronic device

Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Tatsuya Hosotani, Nagaokakyo, JP;

Kiyokazu Yamada, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Attorney:

Studebaker Brackett PLLC

Primary Examiner:

Eun Hwa Kim

Assistant Examiner:

Ana Veruska Guerrero

Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61L 31/02 (2006.01); A61L 31/08 (2006.01); H01F 27/28 (2006.01); H01F 38/14 (2006.01); H02J 7/02 (2016.01); H02J 50/00 (2016.01); H02J 50/12 (2016.01); H02J 50/80 (2016.01); A61N 1/04 (2006.01); A61N 1/05 (2006.01); A61N 1/08 (2006.01); A61N 1/36 (2006.01); H01F 27/24 (2006.01); H02J 50/70 (2016.01);
U.S. Cl.
CPC ...
A61B 5/686 (2013.01); A61B 5/0026 (2013.01); A61B 5/0031 (2013.01); A61L 31/022 (2013.01); A61L 31/026 (2013.01); A61L 31/028 (2013.01); A61L 31/082 (2013.01); H01F 27/28 (2013.01); H01F 38/14 (2013.01); H02J 7/02 (2013.01); H02J 50/005 (2020.01); H02J 50/12 (2016.02); H02J 50/80 (2016.02); A61B 5/0036 (2018.08); A61B 2560/02 (2013.01); A61B 2560/0219 (2013.01); A61B 2560/0406 (2013.01); A61L 31/024 (2013.01); A61L 2400/18 (2013.01); A61N 1/0472 (2013.01); A61N 1/05 (2013.01); A61N 1/0529 (2013.01); A61N 1/056 (2013.01); A61N 1/08 (2013.01); A61N 1/3605 (2013.01); A61N 1/36062 (2017.08); H01F 27/24 (2013.01); H02J 50/70 (2016.02);
Abstract

An in-vivo implantable electronic device includes a housing, a power reception coil, and an electronic circuit. The housing is formed of a biocompatible material and forms an internal space sealed. The power reception coil is disposed in the internal space of the housing and receives power by interacting with an electromagnetic field formed by an external electric field or magnetic field, or transmits an electromagnetic wave to the outside. The electronic circuit is disposed in the internal space, is connected to the power reception coil, and performs at least processing of an electric signal. The housing includes a first member in a box shape formed of a biocompatible metal material and having an opening, a second member formed of a biocompatible nonmetal material and having a shape that closes the opening, a packing in an annular shape disposed between the first member and the second member.

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