The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Mar. 10, 2022
Applicant:

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Jui Lin Tsai, Taipei, TW;

Chien Tien Wang, Taipei, TW;

Shu-Hua Yang, Taipei, TW;

Hsin Wei Tsai, Taipei, TW;

You-Chen Yu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 55/25 (2025.01); H01L 25/16 (2023.01); H10F 30/225 (2025.01); H10F 77/40 (2025.01);
U.S. Cl.
CPC ...
H10F 55/25 (2025.01); H01L 25/167 (2013.01); H01L 2924/12041 (2013.01); H10F 30/225 (2025.01); H10F 77/407 (2025.01);
Abstract

An optoelectronic module, including a substrate, a covering member, a light emitting element, and a light receiving element, is provided. The covering member is disposed on the substrate and includes an upper cover portion, a peripheral sidewall portion connected to the upper cover portion, and an inside partition delimiting a first cavity and a second cavity. The first cavity is separated from the second cavity. The light emitting element is disposed on the substrate as corresponding to the first cavity. The light receiving element is disposed on the substrate as corresponding to the second cavity. The inside partition has a first inner wall surface located in the first cavity and a second inner wall surface located in the second cavity. A first protruded-recessed structure is formed on the first inner wall surface.


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