The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Feb. 09, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Shota Hayashi, Nagaokakyo, JP;

Nobuaki Ogawa, Nagaokakyo, JP;

Yuki Asano, Nagaokakyo, JP;

Akihiro Muranaka, Nagaokakyo, JP;

Takanori Uejima, Nagaokakyo, JP;

Hiromichi Kitajima, Nagaokakyo, JP;

Takahiro Eguchi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H05K 3/28 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0022 (2013.01); H01L 21/56 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01); H01L 25/165 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 9/0039 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/025 (2013.01); H05K 2203/1316 (2013.01);
Abstract

A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.


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