The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Feb. 17, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Do Jae Yoo, Suwon-si, KR;

Yong Gil Namgung, Suwon-si, KR;

Jong Hoon Shin, Suwon-si, KR;

Sang Soon Choi, Suwon-si, KR;

Young Chul An, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/22 (2006.01); B23K 1/00 (2006.01); B23K 1/005 (2006.01); B23K 1/19 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/225 (2013.01); B23K 1/0016 (2013.01); B23K 1/005 (2013.01); B23K 1/19 (2013.01); B23K 2101/42 (2018.08); H05K 2203/16 (2013.01);
Abstract

A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.


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