The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Jul. 26, 2021
Applicant:
Versiv Composites Limited, Kilrush, IE;
Inventors:
Jennifer Adamchuk, Marlborough, MA (US);
Gerard T. Buss, Bedford, NH (US);
Theresa M. Besozzi, Milford, MA (US);
Assignee:
VERSIV COMPOSITES LIMITED, Kilrush, IE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); C09D 5/24 (2006.01); C09D 127/12 (2006.01); H05K 1/05 (2006.01); H05K 3/44 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); C09D 5/24 (2013.01); C09D 127/12 (2013.01); H05K 3/44 (2013.01); C08K 3/34 (2013.01); C08K 3/36 (2013.01); C08K 2201/005 (2013.01); C08K 2201/006 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01);
Abstract
The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.