The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Jan. 27, 2023
Applicant:

Borgwarner Us Technologies Llc, Wilmington, DE (US);

Inventors:

Bryan Rohl, Westfield, IN (US);

Chris Fruth, Kokomo, IN (US);

Edward Choi, Lake Orion, MI (US);

Todd Nakanishi, Elwood, IN (US);

Assignee:

BorgWarner US Technologies LLC, Wilmington, DE (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B60L 3/00 (2019.01); B60L 15/00 (2006.01); B60L 15/08 (2006.01); B60L 50/40 (2019.01); B60L 50/51 (2019.01); B60L 50/60 (2019.01); B60L 50/64 (2019.01); B60L 53/20 (2019.01); B60L 53/22 (2019.01); B60L 53/62 (2019.01); B60R 16/02 (2006.01); G01R 15/20 (2006.01); G06F 1/08 (2006.01); G06F 13/40 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 29/66 (2006.01); H02J 7/00 (2006.01); H02M 1/00 (2007.01); H02M 1/08 (2006.01); H02M 1/084 (2006.01); H02M 1/088 (2006.01); H02M 1/12 (2006.01); H02M 1/32 (2007.01); H02M 1/42 (2007.01); H02M 1/44 (2007.01); H02M 3/335 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01); H02M 7/5387 (2007.01); H02M 7/5395 (2006.01); H02P 27/06 (2006.01); H02P 27/08 (2006.01); H02P 29/024 (2016.01); H02P 29/68 (2016.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H10D 64/01 (2025.01); B60L 15/20 (2006.01); H03K 19/20 (2006.01);
U.S. Cl.
CPC ...
H02P 27/06 (2013.01); B60L 3/003 (2013.01); B60L 15/007 (2013.01); B60L 15/08 (2013.01); B60L 50/40 (2019.02); B60L 50/51 (2019.02); B60L 50/60 (2019.02); B60L 50/64 (2019.02); B60L 53/20 (2019.02); B60L 53/22 (2019.02); B60L 53/62 (2019.02); B60R 16/02 (2013.01); G01R 15/20 (2013.01); G06F 1/08 (2013.01); G06F 13/4004 (2013.01); H01L 21/4882 (2013.01); H01L 23/15 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 23/49562 (2013.01); H01L 23/5383 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H02J 7/0063 (2013.01); H02M 1/0009 (2021.05); H02M 1/0054 (2021.05); H02M 1/08 (2013.01); H02M 1/084 (2013.01); H02M 1/088 (2013.01); H02M 1/123 (2021.05); H02M 1/32 (2013.01); H02M 1/322 (2021.05); H02M 1/327 (2021.05); H02M 1/4258 (2013.01); H02M 1/44 (2013.01); H02M 3/33523 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H02M 7/5387 (2013.01); H02M 7/53871 (2013.01); H02M 7/53875 (2013.01); H02M 7/5395 (2013.01); H02P 27/08 (2013.01); H02P 27/085 (2013.01); H02P 29/024 (2013.01); H02P 29/027 (2013.01); H02P 29/68 (2016.02); H05K 1/145 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 5/0247 (2013.01); H05K 7/20154 (2013.01); H05K 7/2039 (2013.01); H05K 7/2049 (2013.01); H05K 7/20854 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01); H10D 64/018 (2025.01); B60L 15/20 (2013.01); B60L 2210/30 (2013.01); B60L 2210/40 (2013.01); B60L 2210/42 (2013.01); B60L 2210/44 (2013.01); B60L 2240/36 (2013.01); G06F 2213/40 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H02J 2207/20 (2020.01); H02P 2207/05 (2013.01); H03K 19/20 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.


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