The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Dec. 19, 2023
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Jia-Yuan Chen, Miao-Li County, TW;

Tsung-Han Tsai, Miao-Li County, TW;

Kuan-Feng Lee, Miao-Li County, TW;

Yuan-Lin Wu, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 31/14 (2006.01); H01L 31/16 (2006.01); H01L 33/00 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 31/14 (2013.01); H01L 31/16 (2013.01); H01L 33/0012 (2013.01); H01L 33/005 (2013.01); H01L 33/0093 (2020.05); H01L 33/44 (2013.01); H01L 33/48 (2013.01); H01L 33/62 (2013.01);
Abstract

An electronic assembly is provided. The electronic assembly includes a first circuit structure including a conductive structure, a second circuit structure disposed on the first circuit structure, a plurality of electronic elements disposed on the first circuit structure, and a connecting element disposed on the first circuit layer. The connecting element is disposed between two adjacent ones of the plurality electronic elements and electrically connected to the second circuit layer and one of the two adjacent ones of the plurality of electronic elements.


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