The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Oct. 01, 2020
Applicant:

Aledia, Echirolles, FR;

Inventors:

Maxime Boistard, Grenoble, FR;

Philippe Gibert, Saint-Etienne-de-Crossey, FR;

Frédéric Mayer, Voiron, FR;

Eric Pourquier, Grenoble, FR;

Sylvia Scaringella, Montbonnot-Saint-Martin, FR;

Clémence Tallet, Saint Egreve, FR;

Assignee:

Aledia, Champagnier, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 21/306 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/504 (2013.01); H01L 21/30625 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/005 (2013.01); H01L 33/62 (2013.01); H01L 2933/00 (2013.01);
Abstract

A method of manufacturing an optoelectronic device including assemblies of light-emitting diodes (LED) having first and second assemblies and first blocks made of a first photoluminescent material, each covering one of the first assemblies. The method includes the forming of a layer covering the first and second assemblies, the delimiting of first openings in the layer to expose the first assemblies, the filling of the first openings with the first material, and the performing of a chemical-mechanical polishing to delimit the first blocks.


Find Patent Forward Citations

Loading…