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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12261181 B1

PDFFull Text
Date of Patent:
Mar. 25, 2025

Filed:

Feb. 13, 2023

Semiconductor package including image sensor chip, transparent substrate, and joining structure

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Woonbae Kim, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., , KR;

Attorney:

Myers Bigel, P.A.

Primary Examiner:

Jennifer D Bennett

Assistant Examiner:

Erin R Garber

Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14621 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/58 (2013.01); H01L 24/06 (2013.01); H01L 27/14603 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 23/02 (2013.01); H01L 27/1462 (2013.01);
Abstract

A semiconductor package may include an image sensor chip, a transparent substrate spaced apart from the image sensor chip, a joining structure in contact with a top surface of the image sensor chip and a bottom surface of the transparent substrate, on an edge region of the top surface of the image sensor chip, and a circuit substrate electrically connected to the image sensor chip. The image sensor chip may include a penetration electrode which penetrates at least a portion of an internal portion of the image sensor chip, and a terminal pad, which is on the edge region of the top surface of the image sensor chip and is electrically connected to the penetration electrode. The joining structure may include a spacer and an adhesive layer. The joining structure may overlap the terminal pad. The spacer is between the transparent substrate and the terminal pad.

Find Patent Forward Citations

Kim, Woonbae. (2025). Semiconductor package including image sensor chip, transparent substrate, and joining structure (U.S. Patent No. 12261181). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12261181

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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