The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Sep. 23, 2021
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Masaharu Yamaji, Matsumoto, JP;
Taichi Karino, Matsumoto, JP;
Hitoshi Sumida, Matsumoto, JP;
Hideaki Itoh, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01); H03K 17/567 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53223 (2013.01); H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H03K 17/567 (2013.01);
Abstract
A semiconductor device includes: a wiring layer; a titanium nitride layer deposited on the wiring layer; a titanium oxynitride layer deposited on the titanium nitride layer; a titanium oxide layer deposited on the titanium oxynitride layer; and a surface passivation film deposited on the titanium oxide layer, wherein an opening penetrating the titanium nitride layer, the titanium oxynitride layer, the titanium oxide layer, and the surface passivation film is provided to expose a part of the wiring layer so as to serve as a pad.