The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Jun. 01, 2022
Applicant:
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Inventors:
Hiroki Matsuda, Tokyo, JP;
Tsutomu Kawamizu, Tokyo, JP;
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/367 (2013.01);
Abstract
A cooling device that cools a semiconductor component mounted on a surface of a substrate includes a base attached to a back surface of the substrate, and a bottom plate disposed spaced apart from the base. A recessed part recessed toward the substrate side is formed in a region that is a surface, of the base, facing the bottom plate side and corresponds to the semiconductor component.
Matsuda, Hiroki. (2025). Cooling device (U.S. Patent No. 12261100). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12261100
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile