The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Apr. 14, 2022
Applicant:

Zeus Co., Ltd., Hwaseong-si, KR;

Inventors:

Seung Dae Baek, Hwaseong-si, KR;

Sung Yup Kim, Suwon-si, KR;

Jun Goo Park, Hwaseong-si, KR;

Assignee:

ZEUS CO., LTD., Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/12 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B08B 3/12 (2013.01);
Abstract

A wafer processing apparatus of the present invention includes a first chamber unit in which a first wafer part including a retainer ring portion and a plurality of sawn first dies is processed, a second chamber unit in which a second wafer part including a wafer part or a carrier substrate is processed, and a third chamber unit in which the first dies of the first wafer part processed in the first chamber unit and the second wafer part processed in the second chamber unit are stacked and pre-bonded.


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