The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Jul. 12, 2023
Applicant:

Toppan Inc., Tokyo, JP;

Inventors:

Eriko Uehara, Tokyo, JP;

Yukiko Katano, Tokyo, JP;

Shigeki Minemura, Tokyo, JP;

Assignee:

TOPPAN INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); G06K 19/07 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07745 (2013.01); G06K 19/0718 (2013.01); G06K 19/07743 (2013.01); H05K 1/09 (2013.01); H05K 1/186 (2013.01);
Abstract

A card-type medium includes a card body; an exposed component that is accommodated inside an opening formed in a front surface of the card body and is disposed so as to be partially exposed on the front surface; and a circuit board that is embedded in the card body and to which the exposed component is attached. The exposed component includes a first exposed component that is attached to the circuit board with an intermediate spacer interposed therebetween. The first exposed component and the intermediate spacer are joined together by a first conductive joining material. The circuit board and the intermediate spacer are joined together by a second conductive joining material. A joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material are different from each other.


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