The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Dec. 05, 2023
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Mika Juhani Rintamaeki, Redmond, WA (US);

Gregory Allen Nielsen, Kirkland, WA (US);

Rajagopal K. Venkatachalam, Sammamish, WA (US);

Ajit Justin, Sammamish, WA (US);

Francisco Cantu De La Garza, Issaquah, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/32 (2019.01); G05B 17/02 (2006.01); G06F 1/20 (2006.01); G06F 1/3212 (2019.01); G06F 1/3234 (2019.01);
U.S. Cl.
CPC ...
G06F 1/3234 (2013.01); G05B 17/02 (2013.01); G06F 1/206 (2013.01); G06F 1/3212 (2013.01);
Abstract

A method of thermal and power control in a computing device includes, at the computing device, initializing a thermal module of the computing device, receiving data at the thermal module from a first component assigned to an interface of the thermal module, and sending an output to a second component from the thermal module based on the data. Initializing the thermal module includes detecting a presence of a plurality of potential components of the computing device; querying each of the plurality of potential components to determine capabilities of each component; in response to the querying, for each of at least a subset of the plurality of potential components receiving identification information for the component and, based on the received identification information, configuring one or more interfaces of the plurality of predefined interfaces of the thermal module to establish communication with the sub set of components.


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