The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Feb. 07, 2020
Applicant:

National University of Singapore, Singapore, SG;

Inventors:

Chee Keong Tee, Singapore, SG;

Haicheng Yao, Singapore, SG;

Weidong Yang, Singapore, SG;

Yu Jun Tan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 1/22 (2006.01); B81B 1/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01L 1/2287 (2013.01); B81B 1/008 (2013.01); B81C 1/00111 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0361 (2013.01); B81B 2203/04 (2013.01);
Abstract

A sensing structure and a method of fabricating a sensing structure for a compressive-type pressure sensor. The method comprises the steps of providing an elastic micropatterned substrate defining a plurality of 3-dimensional microstructures, each microstructure comprising a tip portion pointing away from the substrate in a first direction; forming a conductive film on the elastic micropatterned substrate such that the 3-dimensional microstructures are substantially covered by the conductive film; and forming cracks in the conductive film in areas on 3-dimensional microstructures.


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