The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Jul. 06, 2021
Applicant:
Dow Silicones Corporation, Midland, MI (US);
Inventors:
Juyoung Yook, Chungcheongbuk-do, KR;
Yoonyoung Kim, Gwank-gu, KR;
Assignee:
Dow Silicones Corporation, Midland, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 5/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 5/00 (2013.01); H01L 21/6836 (2013.01); C09J 2203/326 (2013.01); C09J 2301/302 (2020.08); C09J 2301/416 (2020.08); C09J 2483/00 (2013.01);
Abstract
A curable silicone-(meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone-(meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone-(meth)acrylate pressure sensitive adhesive is exposed to actinic radiation, the resulting silicone-(meth)acrylate adhesive has a subsequent adhesion, which is higher than the initial adhesion.