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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12258472 B1

PDFFull Text
Date of Patent:
Mar. 25, 2025

Filed:

Apr. 23, 2020

Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device

Applicant:

Eneos Corporation, Tokyo, JP;

Inventors:

Yoshinori Nishitani, Tokyo, JP;

Tatsuki Sato, Tokyo, JP;

Masaki Minami, Tokyo, JP;

Assignee:

ENEOS Corporation, Tokyo, JP;

Attorney:

Leydig, Voit & Mayer, Ltd.

Primary Examiner:

Patrick D Niland

Int. Cl.
CPC ...
C08L 79/02 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/26 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08G 73/02 (2006.01); C08K 3/013 (2018.01); C08L 63/00 (2006.01); C08L 79/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C08L 79/02 (2013.01); C08G 59/22 (2013.01); C08G 59/24 (2013.01); C08G 59/26 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C08G 73/0233 (2013.01); C08K 3/013 (2018.01); C08L 63/00 (2013.01); C08L 79/04 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 23/31 (2013.01); C08L 2203/20 (2013.01);
Abstract

Provided is a curable resin composition being excellent in normal-temperature stability for obtaining cured product having high heat resistance, cured product thereof, methods of producing the composition and the product, and a semiconductor device using the product as sealant. Further provided is a resin composition, cured product thereof, and methods of producing the composition and the product, wherein the composition includes: (A) multifunctional benzoxazine compound having at least two benzoxazine rings, (B) epoxy compound containing at least one epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) curing agent; wherein composition consisting of (A), (B), and (C) has weight-average molecular weight of 350 or more and 650 or less in terms of polystyrene. Additionally provided is a semiconductor device where semiconductor element is disposed in the cured product obtained by curing the composition containing components (A) to (C), and optionally components (D) and/or (E).

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