The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Sep. 07, 2021
Applicant:

SK Enpulse Co., Ltd., Gyeonggi-do, KR;

Inventors:

Eun Sun Joeng, Gyeonggi-do, KR;

Jong Wook Yun, Seoul, KR;

Jang Won Seo, Seoul, KR;

Yong Ju Jeong, Gyeonggi-do, KR;

Seung Kyun Kim, Gyeonggi-do, KR;

Assignee:

SK ENPULSE CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/232 (2006.01); B24B 37/24 (2012.01); C08G 18/16 (2006.01); C08G 18/22 (2006.01); C08G 18/32 (2006.01); C08G 18/48 (2006.01); C08G 18/66 (2006.01); C08G 18/76 (2006.01); C09K 3/14 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
C08J 9/232 (2013.01); B24B 37/24 (2013.01); C08G 18/161 (2013.01); C08G 18/168 (2013.01); C08G 18/225 (2013.01); C08G 18/3206 (2013.01); C08G 18/4854 (2013.01); C08G 18/6674 (2013.01); C08G 18/7621 (2013.01); C08G 18/7671 (2013.01); C09K 3/14 (2013.01); H01L 21/31053 (2013.01); C08G 2110/0025 (2021.01); C08J 2203/22 (2013.01); C08J 2375/08 (2013.01);
Abstract

Provided is a polishing pad including a polishing layer, wherein the nuclear magnetic resonance (NMR)C spectrum of a processed composition prepared by adding 1 g of the polishing layer to a 0.3 M aqueous solution of potassium hydroxide (KOH) and allowing the mixture to react in a closed container at a temperature of 150° C. for 48 hours includes a first peak appearing at 15 ppm to 18 ppm, a second peak appearing at 9 ppm to 11 ppm, a third peak appearing at 138 ppm to 143 ppm, and a fourth peak appearing at 55 ppm to 65 ppm, and the softening control index calculated by Equation 1 is 0.10 to 0.45. The polishing pad includes the polishing layer having physical properties corresponding to the softening control index, and thus may exhibit a removal rate and defect prevention performance within desired ranges in polishing of a polishing target.


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