The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
May. 13, 2020
Applicant:
Hosiden Corporation, Osaka, JP;
Inventor:
Shingo Okano, Osaka, JP;
Assignee:
HOSIDEN CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0008 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0353 (2013.01); B81B 2207/096 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01);
Abstract
The present invention provides a substrate that is highly resistant to ESD, on which a reverse sound hole type MEMS microphone can be mounted. The substrate has one surface connected to a MEMS microphone, and comprises a substrate sound hole that penetrates through the substrate and communicates with a sound hole of the MEMS microphone, and a GND pad disposed around the substrate sound hole on another surface of the substrate.
Okano, Shingo. (2025). Substrate and microphone unit (U.S. Patent No. 12258262). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12258262
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile