The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Oct. 23, 2020
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Eric T. Martin, Corvallis, OR (US);

James R. Przybyla, Corvallis, OR (US);

Garrett E. Clark, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/145 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1404 (2013.01); B41J 2/145 (2013.01); B41J 2202/12 (2013.01); B41J 2202/13 (2013.01);
Abstract

In some examples, a fluidic die includes an arrangement of fluidic elements to dispense a fluid, where each fluidic element of the fluidic elements includes a fluidic actuator and a fluid chamber. The fluidic die includes an array of fluid feed holes in a plurality of dimensions to communicate the fluid with the fluidic elements, where each of multiple fluid feed holes along a first dimension of the plurality of dimensions is distinct from multiple fluid feed holes along a second dimension of the plurality of dimensions. The fluidic die includes circuit elements interspersed in regions between the fluidic elements along different axes of the fluidic die, where each circuit element of the circuit elements includes an active device. The fluidic elements and the circuit elements are formed on a common substrate.


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