The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

May. 02, 2023
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Takashi Ike, Miyoshi, JP;

Tatsuya Kojima, Okazaki, JP;

Natsuhiko Katahira, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/68 (2006.01); B29C 70/48 (2006.01); B29K 105/00 (2006.01); B29K 105/08 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 70/48 (2013.01); B29C 70/682 (2013.01); B29K 2105/0097 (2013.01); B29K 2105/0872 (2013.01); B29L 2031/3085 (2013.01);
Abstract

A method for manufacturing a joined body according to an embodiment of the present disclosure is a method for manufacturing a joined body in which composite materials in which fibers are impregnated with resins are heated and joined to each other. The method includes: a step of aligning the composite material with each of a plurality of molding dies, heating the molding dies, and semi-curing the resins of the composite materials; and a step of joining the composite materials to each other by combining and heating the molding dies with which the composite materials are aligned after semi-curing the resins of the composite materials. The molding dies used when semi-curing the resins of the composite materials and the molding dies used when joining the composite materials to each other are the same.


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