The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Feb. 14, 2020
Applicant:

Nissei Plastic Industrial Co., Ltd., Nagano, JP;

Inventors:

Hozumi Yoda, Nagano, JP;

Satoshi Hoshino, Nagano, JP;

Atsushi Murata, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/64 (2006.01); H01F 7/02 (2006.01);
U.S. Cl.
CPC ...
B29C 45/64 (2013.01); H01F 7/02 (2013.01); B29C 2045/645 (2013.01); B29K 2905/00 (2013.01);
Abstract

A mold clamping machine includes a stationary mount, a movable mount, a mold-clamping mechanism and a mold opening and-closing mechanism. The mold-clamping mechanism includes a cylindrical constraining mechanism and has a magnet mechanism built therein. By causing a current to flow or not flow, the constraining mechanism changes to an unconstrained state or to a constraining state. In the unconstrained state, the mold clamping mechanism is movable relative to and along a tie bar. In the constrained state, the mold clamping mechanism becomes unmovable relative to the tie bar. The magnet mechanism positions the mold-clamping mechanism at any desired arbitrary position along the tie bar.


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