The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

Mar. 17, 2021
Applicants:

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhichao Yang, Beijing, CN;

Jian Wang, Beijing, CN;

Yong Zhang, Beijing, CN;

Xianglei Qin, Beijing, CN;

Jian Lin, Beijing, CN;

Limin Zhang, Beijing, CN;

Zepeng Sun, Beijing, CN;

Liangzhen Tang, Beijing, CN;

Zhilong Duan, Beijing, CN;

Honggui Jin, Beijing, CN;

Yashuai An, Beijing, CN;

Lingfang Nie, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); G02F 1/133603 (2013.01); H01L 25/0753 (2013.01);
Abstract

The present disclosure provides a light-emitting substrate, a backlight source, and a display device. The light-emitting substrate includes: a base substrate having a first surface and a second surface which are opposite, and including a light-emitting area and a bonding area located on a side of the light-emitting area; a light-emitting unit disposed on the first surface of the base substrate and located in the light-emitting area, and including a plurality of light-emitting elements which are connected together; and transmission lines disposed on the base substrate; where at least a part of at least one transmission line is located on the second surface of the base substrate, and two ends of the light-emitting unit are respectively connected to the bonding area through different transmission lines.


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