The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Feb. 14, 2022
Applicant:
Db Hitek Co., Ltd., Bucheon-si, KR;
Inventors:
Assignee:
DB HiTek Co., Ltd., Bucheon-si, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01); H10D 62/17 (2025.01);
U.S. Cl.
CPC ...
H10D 62/111 (2025.01); H10D 30/665 (2025.01); H10D 62/127 (2025.01); H10D 62/393 (2025.01);
Abstract
A superjunction semiconductor device having a reduced source area and a method of manufacturing the same and, more particularly, to a semiconductor device and a method of manufacturing the same, in which the semiconductor device realizes a reduction in the area of a source in a body region to reduce the current during a short circuit fault, thus delaying a temperature increase and increasing the time before temperature-related device destruction.