The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Mar. 15, 2023
Ian Getreu, Tigard, OR (US);
James A. Holmes, Fayetteville, AR (US);
Brandon Dyer, Prairie Grove, AR (US);
Jacob Kupernik, Bella Vista, AR (US);
Matthew Barlow, Springdale, AR (US);
Nicholas Chiolino, Springdale, AR (US);
Anthony Matt Francis, Elkins, AR (US);
Ian Getreu, Tigard, OR (US);
James A. Holmes, Fayetteville, AR (US);
Brandon Dyer, Prairie Grove, AR (US);
Jacob Kupernik, Bella Vista, AR (US);
Matthew Barlow, Springdale, AR (US);
Nicholas Chiolino, Springdale, AR (US);
Anthony Matt Francis, Elkins, AR (US);
Abstract
A multi-layer ceramic wiring board is patterned with arrays of footprints for high-temperature surface mounted device active and passive components on one side of the board that is patterned with arrays of standard SMD footprints to enable placement and attachment of components including primary 2-terminal components and active components where the SMD pads are connected through vias and buried-layer interconnect traces to a multiple connection point arrays on the front and back side of the ceramic wiring board. Each pad is connected to multiple instances of the pad grid to connections to be made with a single post-fired print.