The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

Nov. 09, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Chan Hoon Ko, Suwon-si, KR;

Ki Hee Cho, Suwon-si, KR;

Sang Hoon Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 2201/2081 (2013.01);
Abstract

A printed circuit board includes a first insulating layer, a metal pad including a first metal portion disposed on the first insulating layer, and a second metal portion disposed on the first metal portion and integrated with the first metal portion without a boundary therebetween, the second metal portion having a width narrower than a width of the first metal portion on a cross section, a second insulating layer disposed on the first insulating layer and covering at least a portion of a side surface of the first metal portion, and a surface metal layer disposed on the metal pad and covering at least a portion of each of an upper surface and a side surface of the second metal portion.


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