The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

Jul. 12, 2022
Applicant:

Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;

Inventors:

Na Yeon Kim, Seoul, KR;

Young Ju Kim, Gyeonggi-do, KR;

Hee Jun Park, Gyeonggi-do, KR;

Won Hee Lee, Gyeonggi-do, KR;

Assignee:

DONGWOO FINE-CHEM CO., LTD., Jeollabuk-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/59 (2011.01); H01Q 1/24 (2006.01); H01Q 9/04 (2006.01); H01Q 21/08 (2006.01); H01R 12/77 (2011.01); H01R 13/646 (2011.01); H05K 1/02 (2006.01); H01R 12/79 (2011.01);
U.S. Cl.
CPC ...
H01R 12/592 (2013.01); H01Q 1/243 (2013.01); H01Q 9/0407 (2013.01); H01Q 21/08 (2013.01); H01R 12/77 (2013.01); H01R 13/646 (2013.01); H05K 1/0237 (2013.01); H01R 12/79 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A package board according to an embodiment of the present disclosure includes a first core layer, a feeding wiring disposed on the first core layer, and a first connector mounted on the first core layer and electrically connected to the feeding wiring through a row directional side thereof. The feeding wiring includes a first portion extending in a column direction of the first core layer and a second portion bent from the first portion to extend in a row direction of the first core layer.


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