The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Nov. 16, 2021
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Tomoichiro Toyama, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01S 5/023 (2021.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01S 5/023 (2021.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01);
Abstract
The present disclosure provideds a side-view type semiconductor light emitting device of the disclosure includes a multilayer substrate having a plurality of substrates, a plurality of conductive layers, and a plurality of semiconductor light emitting elements. The multilayer substrate has a main surface on which the semiconductor light emitting elements are mounted, a back surface facing an opposite side of the main surface and having external electrodes formed thereon, and a mounting surface intersecting both the main surface and the back surface. The plurality of conductive layers have conductive exposed portions exposed from the mounting surface.