The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Sep. 07, 2020
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Hideki Sawada, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H02M 1/32 (2007.01); H02M 7/48 (2007.01);
U.S. Cl.
CPC ...
H01L 25/162 (2013.01); H01L 23/3121 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H02M 1/32 (2013.01); H02M 7/48 (2013.01);
Abstract
Provided is a semiconductor device comprising: a semiconductor element; a supporting board supporting the semiconductor element; a wiring unit electrically connected to the semiconductor element; and a resin member sealing the semiconductor element. The resin member is provided with a first driving-side opening part, a second driving-side opening part, a first control-side opening part, and a second control-side opening part, in which a part of the wiring unit is exposed and on which electronic parts electrically connected to the wiring unit can be mounted.