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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12255175 B1

PDFFull Text
Date of Patent:
Mar. 18, 2025

Filed:

Aug. 21, 2024

Wafer warpage regulation epoxy functional film, and preparation method and application thereof

Applicant:

Wuhan Sanxuan Technology Co., Ltd, Wuhan, CN;

Inventors:

De Wu, Wuhan, CN;

Qiao Zhou, Wuhan, CN;

Shuhang Liao, Wuhan, CN;

Junxing Su, Wuhan, CN;

Assignee:

Wuhan Sanxuan Technology Co., Ltd, Wuhan, CN;

Attorney:

Nitin Kaushik

Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
H01L 23/00 (2006.01); C08K 3/04 (2006.01); C08K 3/36 (2006.01); C09D 163/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); C09D 163/00 (2013.01); C08K 3/04 (2013.01); C08K 3/36 (2013.01); C08K 2201/005 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Provided in the present invention is a wafer warpage regulation epoxy functional film. The wafer warpage regulation epoxy functional film includes the raw material components, in percentage by mass, 33% of an epoxy resin, 50%-52% of silica, 12%-14% of a curing agent, 1% of a curing accelerator, and 2% of a coloring agent; and the epoxy resin includes a bisphenol F-type epoxy resin and a phenolic epoxy resin. Besides, the above raw material components are stirred and mixed to obtain a slurry, the slurry is coated to a back of a wafer body, and after curing, the epoxy functional film which is formed by the phenolic epoxy resin has high shrinkage and large warpage, to drive the back of the wafer body to warp so as to drive a front of the wafer body to warp backwards.

Find Patent Forward Citations

Wu, De. (2025). Wafer warpage regulation epoxy functional film, and preparation method and application thereof (U.S. Patent No. 12255175). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12255175

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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